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Nanoelectronic Devices

Composants nanoélectroniques

CompoNano - ISSN 2516-3914 - © ISTE Ltd

Aims and scope

Objectifs de la revue

Nanoelectronic Devices covers the following subjects :


– FD-SOI Devices
– Multi-Gate devices on bulk or insulator substrates
– 1D Devices (Nanowires, Carbon Nanotubes, etc.)
– 2D channel Devices
– Multi-channel Devices
– Small Slope Switches Devices (Tunnel FET, FeFET, NEMS, etc.)
– Ultra low power Devices
– Nanodevices with alternative channel materials
– Design, technology, integration, modelling, numerical simulation
of Nanoelectronic devices
– Circuit design based on nanoelectronic devices
– Charge-based and non-charge based (PCRAM, RRAM, MRAM)
DRAM, SRAM, and Non-Volatile Memories

Composants nanoélectroniques couvre les sujets suivants :

– Composants FD-SOI
– Composants Multi-Grilles sur substrats de Si massif ou sur isolant
– Composants à base de structures 1D
– Composants à base de structures 2D
– Composants Multi-Canaux
– Composants Small-Slope-Switches
– Composants très faible consommation
– Matériaux alternatifs pour les canaux des composants nanoélectroniques
– Conception, technologie, intégration, modélisation, simulation numérique
et caractérisation des composants nanoélectroniques
– Conception de circuits basés sur les composants nanoélectroniques
– Mémoires Non-Volatiles, DRAM, SRAM basées sur un stockage de charges
ou une variation de résistance (PCRAM, RRAM, MRAM)

Journal issues


Volume 18- 1

Tunnel FETs


Volume 19- 2



Volume 20- 3

Issue 1

Recent articles

Consideration on Impacts of Electric Field and Physical Confinement on Diffusion Constant and Carrier Lifetime in Insulated-Gate pn-Junction Devices

This paper discusses the impacts of electric field and physical confinement around the pn-junction on the diffusion constant and carrier lifetime of various pn-junction devices fabricated on silicon-on-insulator (SOI) (...)

Analogue and RF performances of Fully Depleted SOI MOSFET

Performance of RF integrated circuit (IC) is directly linked to the analogue and high frequency characteristics of the transistors, the quality of the back-end of line process as well as the electromagnetic properties of (...)

Analytical expression of top surface charge sensitivity in fully depleted semiconductor on insulator MOS transistor

An analytical expression of free top surface charge sensitivity in FDSOI MOS structure has been established for weak inversion region and validated by TCAD numerical simulation. The influence of various FDSOI stack (...)

gm/ID based methodology for capacitive feedback LNA design

A gm/ID based methodology is detailed in this paper in order to help the designers to determine the optimum size of a capacitive feedback LNA by considering the design topology, the specifications to reach and the (...)

22FDX® Technologies for Ultra-Low Power IoT, RF and mmWave Applications

In this work we revisited the 22nm FDSOI technology for lowest power IoT, RF and mmWave applications. Ultra-low leakage and power devices are described, as part of the 22FDX® portfolio. Transistors performance is presented. (...)

Electrical characterization of advanced FDSOI CMOS devices

FDSOI technologies are very promising candidates for future CMOS circuits as they feature low variability, improved short channel effect and good transport characteristics. In this paper, we review the main electrical (...)

Editorial Board

Editor in Chief

CNRS-Grenoble INP-Minatec


SOITEC, Grenoble

CEA-LETI, Grenoble

Olivier THOMAS
CEA-LETI, Grenoble

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