@ARTICLE{10.21494/ISTE.OP.2022.0787, 

TITLE={Electro thermomechanical coupling of a BGA assembly subjected to combined and alternating power and }, 
  
AUTHOR={Ghenam Sinda, El Hami Abdelkhalak, Gafsi Wajih, Akrout Ali, Haddar Mohamed, }, 
	
JOURNAL={Uncertainties and Reliability of Multiphysical Systems}, 
	
VOLUME={5}, 

NUMBER={Issue 2}, 
	
YEAR={2022}, 

URL={http://openscience.fr/Electro-thermomechanical-coupling-of-a-BGA-assembly-subjected-to-combined-and}, 
	
DOI={10.21494/ISTE.OP.2022.0787}, 
	
ISSN={2514-569X}, 
	
ABSTRACT={Lightweight electronic devices and increasing power density are driving designers to constantly improve the performance of electronic systems. Among the frequent loads experienced by this equipment are electrical power cycles and thermal cycles. The combination of these cycles often leads to the failure of the electronic device and consequently to the failure of the entire system. Among the most stressed components in this equipment are the solder joints, whose material is SAC305. In this study, the aim is to study the evolution of the thermal gradient in the case of Power Cycling and Thermal Cycling, either alternated, so it is the Joule and Peltier effects alone, or combined, so it is the combination of the two effects mentioned above plus the heat flow generated during the submission of the equipment in a virtual thermal chamber and its impact on the thermal deformation of solder joints. The finite element method (FEM) is used to simulate the coupled electrical, thermal and mechanical fields in the assembly and to evaluate the response of the solder joints exposed to the mentioned process. Stresses and Strains are evaluated.}}